Wednesday January 25, 2006 |
Title | A Robust Detailed Placement for Mixed-Size IC Designs |
Author | Jason Cong, *Min Xie (Univ. of California, Los Angeles, United States) |
Page | pp. 188 - 194 |
Detailed information (abstract, keywords, etc) | |
PDF file |
Title | FastPlace 2.0: An Efficient Analytical Placer for Mixed-Mode Designs |
Author | *Natarajan Viswanathan, Min Pan, Chris Chu (Iowa State Univ., United States) |
Page | pp. 195 - 200 |
Detailed information (abstract, keywords, etc) | |
PDF file |
Title | Timing-Driven Placement Based on Monotone Cell Ordering Constraints |
Author | Chanseok Hwang, *Massoud Pedram (Univ. of Southern California, United States) |
Page | pp. 201 - 206 |
Detailed information (abstract, keywords, etc) | |
PDF file |
Title | Constraint Driven I/O Planning and Placement for Chip-package Co-design |
Author | *Jinjun Xiong (Univ. of California, Los Angeles, United States), Yiu-Chung Wong, Egino Sarto (Rio Design Automation, United States), Lei He (Univ. of California, Los Angeles, United States) |
Page | pp. 207 - 212 |
Detailed information (abstract, keywords, etc) | |
PDF file |
Title | Simultaneous Block and I/O Buffer Floorplanning for Flip-Chip Design |
Author | *Chih-Yang Peng, Wen-Chang Chao, Yao-Wen Chang (National Taiwan Univ., Taiwan), J.-H. Wang (Faraday Technology Corp., Taiwan) |
Page | pp. 213 - 218 |
Detailed information (abstract, keywords, etc) | |
PDF file |